Yokohama, Japan October 18, 2023 --- Socionext today announced a collaboration with Arm and TSMC for the development of an innovative power-optimized 32-core CPU chiplet in TSMC’s 2nm silicon technology, delivering scalable performance for hyperscale data center server, 5/6G infrastructure, DPU and edge-of-network markets.

This advanced CPU chiplet proof-of-concept using Arm® Neoverse™ CSS technology is designed for single or multiple instantiations within a single package, along with IO and application-specific custom chiplets to optimize performance for a variety of end applications.

Leveraging CPU chiplets, and customized application-specific chiplets, multiple target applications can be supported. When new chiplets become available, a cost-effective package level upgrade path can be supported.

“Socionext is a leading provider of custom SoCs for global hyperscale data center, automotive and networking customers. Driven by commercial and time-to-market benefits, there is a growing customer demand for granular compute power. Leveraging silicon re-use to create multiple product platforms enables innovative system architectures. With leading silicon node enablement and our partnership with Arm, we are designing and delivering highly integrated large scale silicon solutions to global customers,” said Hisato Yoshida, Corporate Executive Vice President and the Head of Global Development Group at Socionext. “This chiplet complements our customers’ current SoC designs and provides system architects new degrees of freedom to deliver many platform variants for a product family.”

“Arm Neoverse CSS is unlocking greater accessibility to custom silicon and driving innovation across the chiplet ecosystem,” said Mohamed Awad, senior vice president and general manager, Infrastructure Line of Business, Arm. “The advanced chiplet proof-of-concept from Socionext is demonstrating what is possible through Arm Total Design and will accelerate the path to custom, workload-optimized solutions for our broader ecosystem.”

Harnessing the power of the ecosystem in the era of custom silicon on Arm
https://www.arm.com/company/news/2023/10/arm-total-design-ecosystem

“TSMC is pleased to support Socionext’s flexible chiplet design with the outstanding performance, form factor and energy efficiency offered by our 2nm technology, as well as our comprehensive ecosystem to accelerate time-to-market of customer product innovations,” said Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC. “We have worked with Socionext across many generations of our leading-edge technology, and look forward to extending this collaboration into the 2nm generation.”

About Socionext Inc.
Socionext Inc. is a global SoC (System-on-Chip) supplier and a pioneer of a unique “Solution SoC” business model through decades of industry experience and expertise. Socionext contributes to global innovation in advanced technologies including automotive, data center, networking, and smart devices. As a trusted silicon partner, Socionext delivers superior features, performance, and quality that differentiate its customers’ products and services from their competition.
Socionext Inc. is headquartered in Yokohama, and has offices in Japan, Asia, United States and Europe to lead its development and sales activities. For more information, visit https://www.socionext.com/en/.

About TSMC
Taiwan Semiconductor Manufacturing Company (TSMC) is the world's largest contract manufacturer of semiconductor chips. Founded in 1987, TSMC created the semiconductor Dedicated IC Foundry business model. In 2022, TSMC served 532 customers and manufactured 12,698 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics.

All company or product names mentioned herein are trademarks or registered trademarks of their respective owners. Information provided in this press release is accurate at time of publication and is subject to change without advance notice.